Method for forming film and processing apparatus
US12112943B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Mar 24, 2022 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Apr 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a film that includes forming a boron nitride film on a substrate, and forming a boron-containing silicon film on the boron nitride film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.