Thermal compression flip chip bump for high performance and fine pitch
US12113038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2020 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Oct 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal compression flip chip (TCFC) bump may be used for high performance products that benefit from a fine pitch. In one example, a new TCFC bump structure adds a metal pad underneath the TCFC copper pillar bump to cover the exposed aluminum bump pad. This new structure prevents the pad from corroding and reduces mechanical stress to the pad and underlying silicon dielectric layers enabling better quality and reliability and further bump size reduction. For example, a flip chip connection may include a substrate; a metal pad on a contact side of the substrate and a first passivation layer on the contact side of the substrate to protect the metal pad from corrosion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.