Manufacturing process for bulk acoustic resonator, and bulk acoustic resonator
US12113503B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2020 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Sep 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/028
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A manufacturing process for a bulk acoustic resonator, comprising: making an acoustic mirror on a substrate; making a bottom electrode layer for covering the acoustic mirror on the substrate; performing chemical treatment on a peripheral part of the bottom electrode layer to form a modified layer, which surrounds the bottom electrode layer; making a piezoelectric layer on the bottom electrode layer; and making a top electrode layer on the piezoelectric layer. A bulk acoustic resonator, comprising: a substrate, an acoustic mirror formed on the substrate, and a bottom electrode layer, a piezoelectric layer and a top electrode layer that are sequentially formed on the substrate with the acoustic mirror, chemical treatment is performed on a part of the bottom electrode layer close to an edge of the acoustic mirror to form a modified layer. Parasitic oscillation of the resonator is inhibited, and wiring of a top electrode is greatly simplified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.