Ingot wafering systems and methods for slicing a silicon ingot
US12115699B2 · kind B2 · utility
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5Claims
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Assignee
Inventors
Key dates
| Filing date | May 8, 2023 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | May 8, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/045
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A slurry sprayer for supplying a slurry to a wire saw during ingot slicing is disclosed. The slurry sprayer includes a main body and a cover plate that is detachable from the main body for cleaning the slurry sprayer. In some embodiments, the slurry sprayer includes an adjustable support that allows the incline angle of the sprayer to be adjusted and allows the vertical and horizontal position of the slurry sprayer to be adjusted. In some embodiments, the slurry sprayer includes two feed openings to allow the slurry pressure to be more equalized across the slurry sprayer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.