Adhesion removal method and film-forming method
US12116675B2 · kind B2 · utility
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1References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 10, 2019 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Mar 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02334
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are an adhesion removal method capable of removing sulfur-containing adhesions that adhere onto the inner surface of a chamber or the inner surface of a pipe connected to the chamber without disassembly of the chamber and a film-forming method. Sulfur-containing adhesions adhering onto at least one of the inner surface of a chamber (10) and the inner surface of a discharge pipe (15) connected to the chamber (10) are removed by reaction with a cleaning gas containing an oxygen-containing compound gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.