Patent · US Active

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

US12119131B2 · kind B2 · utility

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9Claims
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Key dates

Filing dateAug 9, 2021
Grant dateOct 15, 2024
Priority date
Expiry dateFeb 22, 2043

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/12
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.