Substrate drying device and method of drying substrate using the same preliminary class
US12119240B2 · kind B2 · utility
0Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Dec 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.