Unit for supplying substrate treating liquid and apparatus for treating substrate including the same
US12119241B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Aug 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.