Composite substrate for fabricating III-V photodetector arrays
US12119367B2 · kind B2 · utility
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28Claims
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Key dates
| Filing date | Jul 26, 2021 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Nov 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/1248
Abstract
A method for forming a composite substrate containing layers of dissimilar materials is provided. The method includes a step of disposing a release layer over a base substrate where the base substrate is composed of a first material. A template layer is attached to the release layer. Characteristically, the template layer is composed of a second material and adapted to form a compound semiconductor device thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.