Micro-roughened electrodeposited copper foil and copper clad laminate
US12120816B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2021 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jun 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0338
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.