Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same
US12120845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jun 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.