Method of processing workpiece and laser processing apparatus
US12121993B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2022 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | May 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of processing a plate-shaped workpiece includes a sheet affixing step of laying a thermocompression bonding sheet on a surface of the workpiece and heating and pressing the thermocompression bonding sheet against the workpiece to affix the thermocompression bonding sheet to the workpiece, a laser beam applying step of applying a laser beam having a wavelength absorbable by the workpiece to another surface of the workpiece along a projected dicing line established thereon, thereby processing the workpiece along the projected dicing line, and a sheet joining step of pressing the thermocompression bonding sheet while reheating the thermocompression bonding sheet to soften the same, so that the thermocompression bonding sheet is joined up by closing dividing grooves or through holes made in the thermocompression bonding sheet when the workpiece is processed in the laser beam applying step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.