Composition for polishing pad and polishing pad
US12122013B2 · kind B2 · utility
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1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2020 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Nov 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The composition according to an embodiment employs a mixture of curing agents, which comprises a first curing agent containing sulfur and a second curing agent containing an ester group, whereby it is possible to control the physical properties of the polishing pad as necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.