Hot melt adhesive composition
US12122944B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Dec 19, 2019 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | May 17, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2423/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.