Patent · US Active

Method of forming a semiconductor package with connection lug

US12125772B2 · kind B2 · utility

0Cited by

2References

17Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Edward Fuergut · Nuremberg, DE
Martin Gruber · Schwandorf, DE
Herbert Hopfgartner · Seeboden, AT
Bernd Schmoelzer · Radenthein, AT

Key dates

Filing date	May 20, 2021
Grant date	Oct 22, 2024
Priority date	—
Expiry date	Jun 3, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13055
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method includes providing a first lead frame that includes a first die pad and a first row of leads, providing a connection lug, mounting a first semiconductor die on the first die pad, the first semiconductor die including first and second voltage blocking terminals, electrically connecting the connection lug to one of the first and second voltage blocking terminals, electrically connecting a first one of the leads from the first row to an opposite one of the first and second voltage blocking terminals, and forming an encapsulant body of electrically insulating material that encapsulates first die pad and the first semiconductor die. After forming the encapsulant body, the first row of leads each protrude out of a first outer face of the encapsulant body and the connection lug protrudes out of a second outer face of the encapsulant body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.