Patent · US Active

Electronic device packages with internal moisture barriers

US12125806B2 · kind B2 · utility

1Cited by

8References

19Claims

0Family size

Assignee

Wolfspeed, Inc. · US

Inventors

Arthur Fong-Yuen Pun · Raleigh, US
Basim Noori · Chandler, US

Key dates

Filing date	Jul 7, 2023
Grant date	Oct 22, 2024
Priority date	—
Expiry date	Jul 7, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH10D64/257
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of packaging an RF transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.