Patent · US Active

Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other

US12125817B2 · kind B2 · utility

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24Claims

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Assignee

DANFOSS SILICON POWER GMBH · DE

Inventors

Martin Becker · Kiel, DE
André Bastos Abibe · Geesthacht, DE
Ronald Eisele · Surendorf, DE
Jacek Rudzki · Kiel, DE
Frank Osterwald · Kiel, DE
David Benning · Nordborg, DK

Key dates

Filing date	May 6, 2020
Grant date	Oct 22, 2024
Priority date	—
Expiry date	Jun 7, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/37001
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.