Liquid resin composition for sealing and electronic component apparatus
US12131970B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | May 31, 2018 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Oct 20, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0647
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.