Bridge interconnection with layered interconnect structures
US12132002B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2023 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Apr 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10363
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, an apparatus may include a substrate and a bridge embedded in the substrate. The bridge may be configured to route electrical signals between two dies. An interconnect structure, electrically coupled with the bridge, may include a via structure including a first conductive material, a barrier layer including a second conductive material disposed on the via structure, and a solderable material including a third conductive material disposed on the barrier layer. The first conductive material, the second conductive material, and the third conductive material may have different chemical composition. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.