Semiconductor body, avalanche photodiode and method for fabricating a semiconductor body
US12132132B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 29, 2020 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Jul 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F71/121
Abstract
A semiconductor body comprises a buried layer of a first type of conductivity, a first region of the first type of conductivity, a shallow region of a second type of conductivity at a first surface of the semiconductor body, a sinker of the first type of conductivity located at the first surface of the semiconductor body, and a separating region of the first type of conductivity encircling at least one of the sinker and the buried layer. The first region is between the buried layer and the shallow region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.