Patent · US Active

Power electronics module with improved cooling

US12133366B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

DANFOSS SILICON POWER GMBH · DE

Inventors

Stefan Behrendt · Kiel, DE
Ronald Eisele · Surendorf, DE

Key dates

Filing date	Apr 30, 2020
Grant date	Oct 29, 2024
Priority date	—
Expiry date	Oct 19, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a power electronics module including a flat circuit carrier (5) and an electronic assembly (10) arranged in an electrically contacting manner on the upper flat side of the circuit carrier (5) and cooling bodies (20) thermally in contact with the underside of the circuit carrier (5), wherein a heat-conducting bridge (30) arranged on the upper side of the circuit carrier (5), spanning the assembly (10) and extensively covering same, wherein the heat-conducting bridge (30) is in thermal contact with the cooling body (20) at mounting points arranged next to the assembly (10) and the space between the heat-conducting bridge (30) and the circuit carrier (5) is filled with a heat-conducting potting compound (50).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.