PCB heat dissipation assembly and server having same
US12133367B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2019 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Feb 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0272
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.