Stackable photonics die with direct optical interconnect
US12135460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Feb 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.