Compact power electronics module with increased cooling surface

US12136585B2 · kind B2 · utility

Assignee

• DANFOSS SILICON POWER GMBH · DE

Inventors

• Stefan Behrendt · Kiel, DE
• Ronald Eisele · Surendorf, DE

Key dates

• Filing date: Apr 30, 2020
• Grant date: Nov 5, 2024
• Expiry date: Jun 24, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1327
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a power electronics module including a first circuit carrier (5,10, 11), as well as an electronic assembly (20, 30) arranged in an electrically contacting manner on the upper flat side of the first circuit carrier (5, 10, 11), and a first cooling element (40) in thermal contact with the underside of the first circuit carrier (5, 10, 11), wherein the module has at least one second assembly (20, 30) arranged on the upper side of a second circuit carrier (5, 10, 11) and a second cooling element (40) arranged on the underside of the second circuit carrier (5, 10, 11), wherein the first and the second circuit carriers (5, 10, 11) are arranged with their upper sides facing one another and at least one central heat sink (60, 61, 63, 64) that is electrically insulated from the assemblies (20, 30) is arranged in the space between the assemblies (20, 30), wherein the assemblies (20, 30) and the at least one central heat sink (60, 61, 63, 64) are embedded in a heat-conducting potting compound (50), wherein the module has a number N≥3 of circuit carriers (5, 10, 11) with assemblies (20, 30) mounted on their upper sides and cooling elements (40) mounted on their undersi…