Patent · US Active

Multi-device semiconductor chip with electrical access to devices at either side

US12136623B2 · kind B2 · utility

0Cited by

2References

12Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Edward Fuergut · Nuremberg, DE
Peter Friedrichs · Koblenzer Straße, DE
Ralf Otremba · Kaufbeuren, DE
Hans-Joachim Schulze · Taufkirchen, DE

Key dates

Filing date	Nov 11, 2020
Grant date	Nov 5, 2024
Priority date	—
Expiry date	Apr 24, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH10D12/441
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip includes a semiconductor body having a main surface and a rear surface opposite the main surface, a first bond pad disposed on the main surface, a second bond pad disposed on the rear surface, a first switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the first bond pad, and a second switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the second bond pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.