Patent · US Active

Package with self shielding

US12137516B2 · kind B2 · utility

0Cited by

11References

17Claims

0Family size

Assignee

Avago Technologies International Sales Pte. Limited · SG

Inventors

Hongya Xu · Taufkirchen, DE
Valter Pasku · Fier, AL
Martin Handtmann · Riemerling, DE
Lueder Elbrecht · Munich, DE
Li Sun · San Jose, US

Key dates

Filing date	Oct 6, 2022
Grant date	Nov 5, 2024
Priority date	—
Expiry date	May 11, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09618
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One way to stop electromagnetic fields from leaking outside of a module is an electric wall. Embodiments of the present disclosure are directed to emulating an electric wall with through vias. The through vias may be arranged around cavities in the printed circuit board. The density of the through vias may be selected based on an expected wavelength of the electromagnetic fields. The printed circuit board may then self-isolate components within the cavities from the electromagnetic fields.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.