Apparatus for treating substrate
US12138667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2022 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having an inner space therein; a treating container disposed within the inner space and having a treating space; a substrate support unit supporting a substrate in the treating space; a liquid supply unit supplying a liquid to the substrate supported by the substrate support unit; an exhaust unit exhausting a fume generated in the treating space; an airflow supply unit coupled to a top side of the housing and supplying a gas to form a downward airflow to the inner space; and a perforated plate disposed between the treating container and the airflow supply unit and discharging the gas to the inner space, and wherein the perforated plate comprises: a bottom portion and a side portion, the side portion comprising a first side portion, and the first side portion extending and upwardly inclining from the bottom portion to a first sidewall of the housing, and having a first hole for discharging the gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.