Polishing system apparatus and methods for defect reduction at a substrate edge
US12138732B2 · kind B2 · utility
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32References
17Claims
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Key dates
| Filing date | Dec 14, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Oct 25, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments herein include carrier loading stations and methods related thereto which may be used to beneficially remove nano-scale and/or micron-scale particles adhered to a bevel edge of a substrate before polishing of the substrate. By removing such contaminates, e.g., loosely adhered particles of dielectric material, from the bevel edge, contamination of the polishing interface can be avoided thus preventing and/or substantially reducing scratch related defectivity associated therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.