Polishing pad sheet, polishing pad, and method for manufacturing semiconductor device
US12138736B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2021 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Feb 28, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad sheet which provides optimized interfacial properties for the laminated structure of a polishing pad based on appropriate elasticity and high durability, and in which the polishing pad having the polishing pad sheet applied thereto not only has its intrinsic function such as the polishing rate or the like, but also is capable of realizing the function without damage even during the polishing process in a wet environment for a long time, and a polishing pad to which the polishing pad sheet is applied. The polishing pad sheet includes: a first surface which is a polishing layer attachment surface; and a second surface which is a rear surface of the first surface, wherein the first surface has a value of the following Equation 1 of 4.20 to 5.50:4.20≤(|Sv|)/Sz×P (%)≤5.50.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.