Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same
US12139811B2 · kind B2 · utility
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1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Oct 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.