Large area seamless master and imprint stamp manufacturing method
US12140864B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Oct 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0035
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present disclosure generally relate to pattern replication, imprint lithography, and more particularly to methods and apparatuses for creating a large area imprint without a seam. Methods disclosed herein generally include filling seams between pairs of masters with a filler material such that the seams are flush with a surface of the masters having a plurality of features disposed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.