Generalized boot operation for disaggregated, multiple (multi-) die computing systems, and related methods
US12141587B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2022 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Feb 16, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/4282
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Generalized boot operations for disaggregated, multiple (multi-) semiconductor die (“die”) computing system, and related methods and computer-readable media are disclosed. In exemplary aspects, to provide for generalized boot-up firmware/software for the computing system that does not have to be reconfigured for different configurations of dies in variations of IC packages, a CPU die (or other die) designated as a primary die is configured to perform a discoverable boot process over a side-band discovery bus to discover the other dies present in an IC package of the computing system and to then control their boot-up operations. In this manner, the boot-up firmware/software executed by the primary die to boot-up the computing system can be generalized irrespective of the number of dies and their particular configuration. In this manner, a generalized boot-up firmware/software can be provided to control boot-up operations of the computing system independent of specific dies included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.