Carrier for microelectronic assemblies having direct bonding

US12142510B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Shawna M. Liff · Scottsdale, US
• Johanna M. Swan · Scottsdale, US
• Adel A. Elsherbini · Chandler, US
• Michael Baker · Warren, US
• Aleksandar Aleksov · Chandler, US
• Feras Eid · Chandler, US

Key dates

• Filing date: Dec 23, 2020
• Grant date: Nov 12, 2024
• Expiry date: Mar 11, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/75985
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Described herein are carrier assemblies, and related devices and methods. In some embodiments, a carrier assembly includes a carrier; a textured material including texturized microstructures coupled to the carrier; and microelectronic components mechanically coupled to the texturized microstructures. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; an electrode on the front side of the carrier; a dielectric material on the electrode; a charging contact on the back side coupled to the electrode; and microelectronic components electrostatically coupled to the front side of the carrier. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; electrodes on the front side; a dielectric material including texturized microstructures on the electrodes; charging contacts on the back side coupled to the plurality of electrodes; and microelectronic components mechanically and electrostatically coupled to the front side of the carrier.