Electronic component and manufacturing method thereof
US12142554B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2021 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Dec 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.