Patent · US Active

Composite bridge die-to-die interconnects for integrated-circuit packages

US12142570B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Jenny Shio Yin Ong · Merang, MY
Ping Ping Ooi · Butterworth, MY
Seok Ling Lim · Kulim, MY

Key dates

Filing date	Oct 27, 2022
Grant date	Nov 12, 2024
Priority date	—
Expiry date	Oct 27, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed embodiments include composite-bridge die-to-die interconnects that are on a die side of an integrated-circuit package substrate and that contacts two IC dice and a passive device that is in a molding material, where the molding material also contacts the two IC dice.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.