Apparatus and method for manufacturing semiconductor film
US12146220B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Mar 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present application provides an apparatus and a method for manufacturing a semiconductor film. The apparatus includes: a chamber; a spray board arranged at a top of the chamber; a wafer pocket arranged opposite to the spray board in the chamber; and a pumping part arranged close to an inner side wall of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.