Flexible vapor chamber with shape memory material
US12146476B2 · kind B2 · utility
1Cited by
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17Claims
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Assignee
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Key dates
| Filing date | Dec 23, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Jul 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20318
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.