Method for manufacturing electronic device
US12148630B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Mar 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier, forming a first base layer on the carrier; and forming working units on the first base layer. The working units are spaced apart from one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.