Package device and manufacturing method thereof
US12148686B2 · kind B2 · utility
0Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Jan 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.