Detection substrate and manufacturing method thereof, flat panel detector and manufacturing method thereof
US12148720B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 24, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Mar 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/1898
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A detection substrate and manufacturing method thereof, a flat panel detector and manufacturing method thereof. The detection substrate includes: a substrate including a detection region, a binding region, a controllable on-off region, and a cutting region; a plurality of detection units including transistors and photosensitive devices located in the detection region, a transistor includes a gate, a first electrode and a second electrode; a photosensitive device is connected to the first or second electrode; a plurality of conductive wires, one end is connected to the gate, and the other end is extended to the binding region; a conductive ring disposed in the cutting region; a plurality of detection wires, one end is connected to the conductive ring, the other end is connected to the conductive wires, the detection wires are passed through the controllable on-off region; the detection wires located in the controllable on-off region can have a disconnected state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.