Inventor · Nanhu, CN

Bin Zhao

300Patents
25h-index
491Co-inventors
93Inventor score

Filing activity: Jan 16, 1996 → Apr 22, 2025

Most-cited inventions

PatentTitleAreaCited byStatus
US5674787A Selective electroless copper deposited interconnect plugs for ULSI applications Emerging Cross-Sectional Technologies 640 Expired
US5695810A Use of cobalt tungsten phosphide as a barrier material for copper metallization Electricity 606 Expired
US6187672A Interconnect with low dielectric constant insulators for semiconductor integrated circuit manufacturing Electricity 477 Expired
US5824599A Protected encapsulation of catalytic layer for electroless copper interconnect Emerging Cross-Sectional Technologies 459 Expired
US5891513A Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications Emerging Cross-Sectional Technologies 450 Expired
US5830805A Electroless deposition equipment or apparatus and method of performing electroless deposition Emerging Cross-Sectional Technologies 292 Expired
US6509623B2 Microelectronic air-gap structures and methods of forming the same Electricity 232 Expired
US6567813B1 Quality of service maintenance for distributed collaborative computing Physics 230 Expired
US6037664A Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer Emerging Cross-Sectional Technologies 186 Expired
US6100184A Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer Emerging Cross-Sectional Technologies 148 Expired
US6071809A Methods for forming high-performing dual-damascene interconnect structures Electricity 144 Expired
US7408330B2 Voltage up-conversion circuit using low voltage transistors Electricity 128 Active
US7130883B2 Distributed network system architecture for collaborative computing Electricity 115 Expired
US6925645B2 Fault tolerant server architecture for collaborative computing Electricity 108 Expired
US7073127B2 Video editing GUI with layer view Physics 107 Expired
US7069298B2 Fault-tolerant distributed system for collaborative computing Emerging Cross-Sectional Technologies 106 Expired
US6245663A IC interconnect structures and methods for making same Electricity 82 Expired
US5736457A Method of making a damascene metallization Electricity 77 Expired
US6211561A Interconnect structure and method employing air gaps between metal lines and between metal layers Electricity 73 Expired
US7353253B1 Peer-to-peer messaging system Electricity 65 Expired
US6417094B1 Dual-damascene interconnect structures and methods of fabricating same Electricity 63 Expired
US6271127A Method for dual damascene process using electron beam and ion implantation cure methods for low dielectric constant materials Emerging Cross-Sectional Technologies 60 Expired
US6198170A Bonding pad and support structure and method for their fabrication Electricity 59 Expired
US6627539B1 Method of forming dual-damascene interconnect structures employing low-k dielectric materials Electricity 50 Expired
US6984577B1 Damascene interconnect structure and fabrication method having air gaps between metal lines and metal layers Electricity 26 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.