LED circuit board structure and LED testing and packaging method
US12150242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Mar 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LED circuit board structure includes first color LEDs, second color LEDs, third color LEDs, a carrier board, first testing wires, first connecting wires, second testing wires and second connecting wires. Each of the first testing wire is located at the carrier board and electrically connects two first color LEDs in a pixel-front-side-pattern region in parallel. The first connecting wire electrically connects two first testing wires in adjacent two pixel-front-side-pattern regions. Each of the second testing wire is located at the carrier board and electrically connects two second color LEDs in a pixel-front-side-pattern region in parallel. The second connecting wire electrically connects two second testing wires in adjacent two pixel-front-side-pattern regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.