Hsiao-Lu CHEN
3Patents
0h-index
4Co-inventors
21Inventor score
Filing activity: Sep 16, 2022 → Feb 7, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12150242B2 | LED circuit board structure and LED testing and packaging method | Electricity | 0 | Active |
| US12418011B2 | Bonding and transferring method for die package structures | Electricity | 0 | Active |
| US12417964B2 | Via-filling method of through-glass via substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.