Hybrid heat sink
US12150277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | May 23, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2215/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.