Ye Wang
37Patents
6h-index
55Co-inventors
72Inventor score
Filing activity: Jan 20, 2000 → Apr 12, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7939990B2 | Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations | Electricity | 17 | Active |
| US7955885B1 | Methods of forming packaged micro-electromechanical devices | Performing Operations; Transporting | 16 | Active |
| US6451252B1 | Odor removal system and method having ozone and non-thermal plasma treatment | Chemistry; Metallurgy | 15 | Expired |
| US7834524B2 | Micro-electromechanical devices having variable capacitors therein that compensate for temperature-induced frequency drift in acoustic resonators | Emerging Cross-Sectional Technologies | 8 | Active |
| US8638178B1 | Methods of testing packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonators having hermetic seals | Electricity | 7 | Active |
| US8111499B2 | System and method of sensing and removing residual charge from a processed wafer | Electricity | 7 | Active |
| US10526701B2 | Multi-cycle ALD process for film uniformity and thickness profile modulation | Chemistry; Metallurgy | 6 | Active |
| US8610336B1 | Microelectromechanical resonators having resistive heating elements therein configured to provide frequency tuning through convective heating of resonator bodies | Electricity | 6 | Active |
| US8106724B1 | Thin-film bulk acoustic resonators having perforated resonator body supports that enhance quality factor | Electricity | 6 | Active |
| US9269678B2 | Bond pad structure and method of manufacturing the same | Electricity | 3 | Active |
| US7863697B2 | Method and apparatus for MEMS oscillator | Electricity | 3 | Active |
| US8608851B2 | Plasma confinement apparatus, and method for confining a plasma | Electricity | 3 | Active |
| US8361331B2 | MEMS mirror system for laser printing applications | Physics | 2 | Active |
| US9824828B2 | High specific capacitance and high power density of printed flexible micro-supercapacitors | Emerging Cross-Sectional Technologies | 2 | Active |
| US8314984B2 | Method and system for optical MEMS with flexible landing structures | Emerging Cross-Sectional Technologies | 2 | Active |
| US8159740B2 | Fabrication of a high fill ratio silicon spatial light modulator | Physics | 1 | Active |
| US7898561B2 | MEMS mirror system for laser printing applications | Physics | 1 | Active |
| US8530258B2 | Method and apparatus for MEMS oscillator | Electricity | 1 | Active |
| US8105736B2 | Method and system for overlay correction during photolithography | Physics | 1 | Active |
| US7453624B2 | Projection display system including a high fill ratio silicon spatial light modulator | Physics | 1 | Active |
| US9691703B2 | Bond pad structure with dual passivation layers | Electricity | 1 | Active |
| US7675670B2 | Fabrication of a high fill ratio silicon spatial light modulator | Physics | 1 | Active |
| US11522725B2 | Reducing amount of helper data in silicon physical unclonable functions via lossy compression without production-time error characterization | Electricity | 0 | Active |
| US10187965B2 | Plasma confinement apparatus, and method for confining a plasma | Electricity | 0 | Active |
| US7522330B2 | High fill ratio silicon spatial light modulator | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.