Micromechanical component for a sensor device or microphone device

US12151936B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Heribert Weber · Leverkusen, DE
• Andreas Scheurle · Leonberg, DE
• Christoph Hermes · Kirchentellinsfurt, DE
• Peter Schmollngruber · Aidlingen, DE
• Thomas Friedrich · Bietigheim-Bissingen, DE

Key dates

• Filing date: Jan 12, 2021
• Grant date: Nov 26, 2024
• Expiry date: Oct 31, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R2201/003
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micromechanical component for a sensor device or microphone device. The micromechanical component includes a diaphragm with a diaphragm inner side to which an electrode structure is directly or indirectly connected; and a cavity that is formed at least in a volume that is exposed by at least one removed area of at least one sacrificial layer. At least one residual area made of at least one electrically insulating sacrificial layer material of the at least one sacrificial layer is also present at the micromechanical component, and including at least one insulation area made of at least one electrically insulating material that is not the same as the electrically insulating sacrificial layer material. The electrode structure is electrically insulated from the diaphragm, and/or the at least one residual area of the at least one sacrificial layer is delimited from the cavity, using the at least one insulation area.