Methods to selectively embed magnetic materials in substrate and corresponding structures
US12154715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2022 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Feb 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.