Automated semiconductor substrate polishing and cleaning
US12154810B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2020 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Jan 13, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/08
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer processing system for processing a set of semiconductor wafers includes a controller, a transfer robot controlled by the controller, a wet bath for containing a cleaning solution, and a cassette positioned in the wet bath for holding the set of wafers. The transfer robot transfers the wafer from a transfer location to the cassette and the controller controls the transfer robot during the transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.