Graphene-coated heat spreader for integrated circuit device assemblies
US12154839B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | Mar 18, 2022 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | May 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83493
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device assembly including a graphene-coated heat spreader, including: a substrate; a die coupled to the substrate; and a heat spreader thermally coupled to the die, the heat spreader comprising: a body of thermally conductive metal defining a cavity at least partially surrounding the die; and a graphene layer contacting a surface of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.