Semiconductor package with nickel-silver pre-plated leadframe
US12154845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2023 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Dec 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a pad and leads, the pad and leads including a base metal predominantly including copper, a first plated metal layer predominantly including nickel in contact with the base metal, and a second plated metal layer predominantly including silver in contact with the first plated metal layer. The first plated metal layer has a first plated metal layer thickness of 0.1 to 5 microns, and the second plated metal layer has a second plated metal layer thickness of 0.2 to 5 microns. The semiconductor package further includes an adhesion promotion coating predominantly including silver oxide in contact with the second plated metal layer opposite the first plated metal layer, a semiconductor die mounted on the pad, a wire bond extending between the semiconductor die and a lead of the leads, and a mold compound covering the semiconductor die and the wire bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.